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DATA SHEET
MOS INTEGRATED CIRCUIT
PD16312
1/4- to 1/11-DUTY FIPTM (VFD) CONTROLLER/DRIVER
The PD16312 is a FIP (fluorescent Indicator Panel, or Vacuum Fluorescent Display) controller/driver that is driven on a 1/4- to 1/11 duty factor. It consists of 11 segment output lines, 6 grid output lines, 5 segment/grid output drive lines, a display memory, a control circuit, and a key scan circuit. Serial data is input to the PD16312 through a three-line serial interface. This FIP controller/driver is ideal as a peripheral device for a single-chip microcomputer.
FEATURES
* Multiple display modes (11-segment & 11-digit to 16-segment & 4-digit) * Key scanning (6 4 matrix) * Dimming circuit (eight steps) * High-voltage output (VDD 35 V max). * LED ports (4 chs., 20 mA max). * General-purpose input port (4 bits) * No external resistors necessary for driver outputs (P-ch open-drain + pull-down resistor output) * Serial interface (CLK, STB, DIN, DOUT)
ORDERING INFORMATION
Part Number Package 44-pin plastic QFP ( 10)
PD16312GB-3B4
Document No. IC-3307 (1st edition) Date Published March 1997 P Printed in Japan
(c)
1993
PD16312
BLOCK DIAGRAM
Command decoder
Dimming circuit
DIN DOUT Serial I/F CLK STB VDD R OSC Timing generator key scan Data selector 5
Seg1 16-bit 16 output latch 5 11 Segment driver Seg11
Display memeory 16 bits x 11 words
Multip lexed diver
Seg12/Grid11
Seg16/Grid7
Key data memory (4 x 6) Key1 to Key4
11-bit shift register 11
5 Grid1 6 Grid driver Grid6
4
SW1 to SW4
4-bit latch 4 4-bit latch LED1 LED4 Key data memory (4 x 6) VDD (+5 V) VSS VEE (0 V) (-30 V)
2
PD16312
PIN CONFIGURATION (Top View)
LED1 LED2 LED3 LED4 Grid1 Grid2 Grid3 35 Grid4 34 33 32 31 30 29 28 27 26 25 24 23 OSC
44
43
42
41
40
39
38
VDD
VSS
37
SW1 SW2 SW3 SW4 DOUT DIN VSS CLK STB KEY1 KEY2
1 2 3 4 5 6 7 8 9
36
Grid5 Grid6 Seg16/Grid7 Seg15/Grid8 Seg14/Grid9 Seg13/Grid10 VEE Seg12/Grid11 Seg11 Seg10 Seg9
10 11
12
13
14
15
16
17
18
19
20
21 Seg7
Seg1/KS1
Seg2/KS2
Seg3/KS3
Seg4/KS4
Seg5/KS5
Seg6/KS6
KEY3
KEY4
Use all power pins.
Seg8
VDD
22
3
PD16312
Pin Function
Symbol DIN Pin Name Data input Pin No 6 Description Input serial data at rising edge of shift clock, starting from the low order bit. Output serial data at the falling edge of the shift clock, starting from low order bit. This is N-ch open-drain output pin. Initializes serial interface at the rising or falling edge of the
DOUT
Data output
5
STB
Strobe
9
PD16312. It then waits for reception of a command. Data input
after STB has fallen is processed as a command. While command data is processed, current processing is stopped, and the serial interface is initialized. While STB is high, CLK is ignored. CLK Clock input 8 Reads serial data at the rising edge, and outputs data at the falling edge. Connect resistor to this pin to determine the oscillation frequency to this pin. Segment output pins (Dual function as key source)
OSC
Oscillator pin
44
Seg1/KS1 to Seg6/KS6 Seg7 to Seg11
High-voltage output
15 to 20
High-voltage output (segment) High-voltage output (grid) High-voltage output (segment/grid) LED output Key data input Switch input Logic power Logic ground Pull-down level
21 to 25
Segment output pins
Grid1 to Grid6 Seg12/Grid11 to Seg16/Grid7 LED1 to LED4 KEY1 to KEY4 SW1 to SW4 VDD VSS VEE
37 to 32 26, 28 to 31
Grid output pins These pins are selectable for segment or grid driving.
42 to 39 10 to 13 1 to 4 14, 38 7, 43 27
CMOS output. +20 mA max. Data input to these pins is latched at the end of the display cycle. These pins constitute a 4-bit general-purpose input port. 5 V 10 % Connect this pin to system GND. VDD 35 V max.
4
PD16312
Display RAM Address and Display Mode The display RAM stores the data transmitted from an external device to the PD16312 through the serial interface, and is assigned addresses as follows, in 8 bits unit:
Seg1 00HL 02HL 04HL 06HL 08HL 0AHL 0CHL 0EHL 10HL 12HL 14HL Seg4 00HU 02HU 04HU 06HU 08HU 0AHU 0CHU 0EHU 10HU 12HU 14HU Seg8 Seg12 01HL 03HL 05HL 07HL 09HL 0BHL 0DHL 0FHL 11HL 13HL 15HL Seg16 01HU 03HU 05HU 07HU 09HU 0BHU 0DHU 0FHU 11HU 13HU 15HU DIG1 DIG2 DIG3 DIG4 DIG5 DIG6 DIG7 DIG8 DIG9 DIG10 DIG11
b0 xxHL
b3 b4 xxHU
b7
Lower 4 bits
Higher 4 bits
5
PD16312
Key Matrix and Key-Input Data Storage RAM The key matrix is made up of a 6 4 matrix, as shown below.
KEY1 KEY2 KEY3 KEY4
Seg1/KS1
Seg2/KS2
Seg3/KS3
Seg4/KS4
Seg5/KS5
The data of each key is stored as illustrated below, and is read with the read command, starting from the least significant bit.
KEY1...KEY4 Seg1/KS1 Seg3/KS3 Seg5/KS5 b0------------ b3 KEY1...KEY4 Seg2/KS2 Seg4/KS4 Seg6/KS6 b4 ------------b7 Reading sequence
LED Port Data is written to the LED port with the write command, starting from the least port's least significant bit. When a bit of this port is 0, the corresponding LED lights; when the bit is 1, the LED truns off. The data of bits 5 through 8 are ignored.
MSB - - - - b3 b2 b1 LSB b0
Seg6/KS6
LED1 Don't care LED2 LED3 LED4
On power application, all LEDs are unlit.
6
PD16312
SW Data SW data is read with the read command, starting from the least significant bit. Bits 5 through 8 of the SW data are 0.
MSB 0 0 0 0 b3 b2 b1 LSB b0
SW1 SW2 SW3 SW4
Commands Commands set the display mode and status of the FIP driver. The first 1 byte input to the PD16312 through the DIN pin after the STB pin has fallen is regarded as a command. If STB is set high while commands/data are transmitted, serial communication is initialized, and the commands/data being transmitted are invalid (however, the commands/data previously transmitted remain valid). (1) Display mode setting commands These commands initialize the PD16312 and select the number of segments and the number of grids (1/4 to 1/11 duty, 11 segments to 16 segments). When these commands are executed, the display is forcibly turned off, and key scanning is also stopped. To resume display, the display command "ON" must be executed. If the same mode is selected, however, nothing happens.
MSB 0 0 - - - b2 b1 LSB b0
Irrelevant
Display mode settings 000 : 4 digits, 16 segments 001 : 5 digits, 16 segments 010 : 6 digits, 16 segments 011 : 7 digits, 15 segments 100 : 8 digits, 14 segments 101 : 9 digits, 13 segments 110 : 10 digits, 12 segments 111 : 11 digits, 11 segments
On power application, the 11-digit, 11-segment mode is selected.
7
PD16312
(2) Data setting commands These commands set data write and data read modes.
MSB 0 1 - - b3 b2 b1 LSB b0
Irrelevant
Data write and read mode settings 00 : Write data to display memory 01 : Write data to LED port 10 : Read key data 11 : Read SW data Address increment mode settings (display memory) 0 : Increments address after data has been written 1 : Fixes address. Test mode settings 0 : Normal operation 1 : Test mode
On power application, the normal operation and address increment modes are set. (3) Address setting commands These commands set an address of the display memory.
MSB 1 1 - b4 b3 b2 b1 LSB b0
Address (00H - 15H)
If address 16H or higher is set, data is ignored, until a valid address is set. On power application, the address is set to 00H.
8
PD16312
(4) Display control commands
MSB 1 0 - - b3 b2 b1 LSB b0
Irrelevant
Dimming quantity settings 000 : Set pulse width to 1/16. 001 : Set pulse width to 2/16. 010 : Set pulse width to 4/16. 011 : Set pulse width to 10/16. 100 : Set pulse width to 11/16. 101 : Set pulse width to 12/16. 110 : Set pulse width to 13/16. 111 : Set pulse width to 14/16. Turns on/off display. Note 0 : Display off (key scan continues ) 1 : Display on
On power application, the 1/16 pulse width is set and the display is turned off. Note On power application, key scanning is stopped.
9
PD16312
Key Scanning and Display Timing
TDISP = 500 s Key scan data
SEG output
DIG1
DIG2
DIG3
DIGn
123456
DIG1
G1
G2
1/16 TDISP
G3
Gn
1 frame = TDISP x (n + 1)
One cycle of key scanning consists of one frame, and data in a 6 4 matrix is stored in RAM.
10
PD16312
Serial Communication Format Reception (command/data write)
If data continues
STB
DIN
b0
b1
b2
b6
b7
CLK
1
2
3
7
8
Transmission (data read)
STB DIN CLK DOUT b0 1 b1 2 b2 3 b3 4 b4 5 b5 6 b6 7 b7 8 1 b0 2 b1 3 b2 4 b3 5 b4 6 b5
tWAITNote
A data read command is set.
Data is read.
Because the DOUT pin is an N-ch, open-drain output pin, be sure to connect an external pull-up resistor to this pin (1 k to 10 k). Note When data is read, a wait time tWAIT of 1 s is necessary since the rising of the eighth clock that has set the command, until the falling of the first clock that has read the data.
11
PD16312
ABSOLUTE MAXIMUM RATINGS (Ta = 25 C, VSS = 0 V)
PARAMETER Logic Supply Voltage Driver Supply Voltage Logic Input Voltage FIP Driver Output Voltage LED Driver Output Current FIP Driver Output Current SYMBOL VDD VEE VI1 VO2 IO1 IO2 RATINGS UNIT V V V V mA mA
0.5 to +7.0
VDD +0.5 to VDD 40
0.5 to VDD +0.5
VEE 0.5 to VDD +0.5 +25
40 (grid) 15 (segment)
800
Note
Power Dissipation Operating Ambient temperature Storage Temperature
PD Topt Tstg
mW
40 to +85 65 to +150
C C
Note Derate at 6.4 mW/C at Ta = 25 C or higher.
RECOMMENDED OPERATING RANGE (Ta = 20 to 70 C, VSS = 0 V)
PARAMETER Logic Supply Voltage High-Level Input Voltage Low-Level Input Voltage Driver Supply Votlage SYMBOL VDD VIH VIL VEE MIN. 4.5 0.7 VDD 0 0 TYP. 5 MAX. 5.5 VDD 0.3 VDD VDD 35 UNIT V V V V TEST CONDITIONS
Maximum power consumption PMAX. = FIP driver dissipation + RL dissipation + LED driver dissipation + dynamic power consumption Where segment current = 3 mA, grid current = 15 mA, and LED current = 20 mA, FIP driver dissipation = number of segments 6 + number of grids/(number of grids + 1) 30 (mW) RL dissipation = (VDD VEE) /50 (number of segments + 1) (mW)
2
LED driver dissipation = number of LEDs 20 (mW) Dynamic power consumption = VDD 5 (mW) Example Where VEE = 25 V, VDD = 5 V, and in 16-segment and 6-digit modes, FIP driver dissipation = 16 6 + 6/7 30 = 122 RL dissipation = 30 /50 17 = 306
2
LED driver dissipation = 4 20 = 80 Dynamic power consumption = 5 5 = 25 Total 553 mW
12
PD16312
ELECTRICAL CHARACTERISTICS (Ta = 20 to +70 C, VDD = 4.5 to 5.5 V, VSS = 0 V, VEE = VDD 35 V)
PARAMETER High-Level Output Voltage Low-Level Output Voltage Low-Level Output Voltage High-Level Output Current High-Level Output Current SYMBOL VOH1 VOL1 VOL2 IOH21 IOH22 MIN. 0.9 VDD 1 0.4 TYP. MAX. UNIT V V V mA mA TEST CONDITIONS LED1 LED4, IOH1 = 1 mA LED1 LED4, IOL1 = 20 mA DOUT, IOL2 = 4 mA VO = VDD 2 V, Seg1 to Seg11 VO = VDD 2 V, Grid1 to Grid6 Seg12/ Grid11 to Seg16/ Grid7 VO = VDD 35 V, driver off Driver output VI = VDD or VSS
3 15 10
50 100 150
Driver Leakage Current Output Pull-Down Resistor Input Current High-Level Input Voltage Low-Level Input Voltage Hysteresis Voltage Dynamic Current Consumption
IOLEAK RL II VIH VIL VH IDDdyn 0.35 0.7 VDD
A
K
1
A
V
0.3 VDD
V V CLK, DIN, STB Under no load, display off
5
mA
SWITCHING CHARACTERISTICS (Ta = 20 to +70 C, VDD = 4.5 to 5.5 V, VEE = 30 V)
PARAMETER Oscillation Frequency Propagation Delay Time SYMBOL tOSC tPLZ tPZL Rise Time tTZH1 tTZH2 MIN. 350 TYP. 500 MAX. 650 300 100 2 0.5 UNIT kHz ns ns TEST CONDITIONS R = 51 k CLK DOUT CL = 15 pF, RL = 10 k CL = 300 pF Seg1 to Seg11 Grid1 to Grid6, Seg12/Grid11 to Seg16/Grid7 CL = 300 pF, Segn, Gridn Duty = 50 %
s s
Fall Time Maximum Clock Frequency Input Capacitance
tTHZ fmax. CI 1
120
s
MHz
15
pF
TIMING CONDITIONS (Ta = 20 to 70 C, VDD = 4.5 to 5.5 V)
PARAMETER Clock Pule Width Strobe Pulse Width Data Setup Time Data Hold Time Clock-Strobe Time Wait Time SYMBOL PWCLK PWSTB tSETUP tHOLD tCLK-STB tWAIT MIN. 400 1 100 100 1 1 TYP. MAX. UNIT ns TEST CONDITIONS
s
ns ns
s s
CLK STB CLK CLK
Note
Note Refer to page 11.
13
PD16312
Switching Characteristic Waveforms
fOSC
OSC 50 %
PWSTB
STB PWCLK PWCLK tCLK-STB
CLK
tSETUP
tHOLD
DIN tPZL DOUT tPLZ
tTHZ 90 % Sn/Gn 10 %
tTZH
14
PD16312
Applications Updating display memory by incrementing address
STB
CLK
DIN
Command 1
Command 2
Command 3
Data 1
Data n
Command 4
Command 1: sets display mode Command 2: sets data Command 3: sets address Data 1 to n: transfers display data (22 bytes max.) Command 4: controls diplay Updating specific address
STB
CLK
DIN
Command 1
Command 2
Data
Command 2
Data
Command 1: sets data Command 2: sets address Data: display data
15
PD16312
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in cae other soldering process is used, or in case soldering is done under different conditions.
PC16312GB-3B4
Soldering process Infrared ray reflow Soldering conditions Peak package's surface temperature: 235 C or below, Reflow time: 30 seconds or below (210 C or higher), Number of reflow process: 2, Exposure limit*: None Peak package's surface temperature: 215 C or below, Reflow time: 40 seconds or below (200 C or higher), Number of reflow process: 2, Exposure limit*: None Solder temperature: 260 C or below, Flow time: 10 seconds or below Number of flow process: 1, Exposure limit*: None Terminal temperature: 300 C or below, Flow time 10 seconds or below, Exposure limit*: None Symbol IR35-00-2
VPS
VP15-00-2
Wave soldering
WS60-00-1
Partial heating method
* Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 C and relative humidity at 65 % or less. Note Do not apply more than a single process at once, except for "Partial heating method".
16
PPD16312
44 PIN PLASTIC QFP ( 10)
A B
33 34
23 22
detail of lead end
C
D
S Q R
44 1
12 11
F G H P
N
NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of its true position (T.P.) at maximum material condition.
J I
M
K M L
ITEM A B C D F G H I J K L M N P Q R S MILLIMETERS 13.60.4 10.00.2 10.00.2 13.60.4 1.0 1.0 0.350.10 0.15 0.8 (T.P.) 1.80.2 0.80.2 0.15 +0.10 -0.05 0.10 2.7 0.10.1 55 3.0 MAX. INCHES 0.535 +0.017 -0.016 0.394 +0.008 -0.009 0.394 +0.008 -0.009 0.535 +0.017 -0.016 0.039 0.039 0.014 +0.004 -0.005 0.006 0.031 (T.P) 0.071 +0.008 -0.009 0.031 +0.009 -0.008 0.006 +0.004 -0.003 0.004 0.106 0.0040.004 55 0.119 MAX. P44GB-80-3B4-3
17
PD16312
[MEMO]
18
PD16312
[MEMO]
19
PD16312
FIPTM is a trademark of NEC Corporation.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
M4 96. 5

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